125 125 hollow slider momentary type hollow type supporting designs such as led illumination speg style speg120100 japan export 1.1 1 SPEG110100 without with 1, 2 0 0 4,800 product line total travel mm ground terminal poles minimum order unit pcs. product no. refer to p.138 for soldering conditions. typical specifications items specifications rating max./min.resistive load 1ma 5v dc / 50 b a 3v dc contact resistance initial/after operating life 200m max. / 500m max. operating forces 2.16n operating life without load 30,000 cycles with load 30,000 cycles 1ma 5v dc pc board mounting hole dimensions yy ? ? ? ? circuit diagram dimensions unit:mm in case of using ground terminal in case of not using ground terminal yy above dimensions indicate with ground terminal version. note ? ? ? 5 p u b m 5 s b w f m 1 p t j u j p o ) j h i p g q s p e v d u ' s b n f g p s n p v o u j o h ? $ $ unit:mm reel size packing specifications taping number of packages pcs. tape width mm export package measurements mm 1 reel 1 case /japan 1 case /export packing 1, 2 0 0 2,400 4,800 24 428413172 vertical type horizontal type detector slide push rotary power dual-in-line package type
114 114 vertical type series vertical speh speg spej spph2 spph4 spph1 photo dimensions mm w 6 7.19 7 6 6.5 10 d 6 8.39 7 6.5 8.5 10 h 5 3.5 5.95 6.5 8.5 travel mm 1.7 1 2.2 1. 5 total travel mm 1. 6 1.1 1.7 1. 5 3 2.5 number of poles 1 1 2 2 operating temperature range ?40 to 90 ?10 t o 60 ?40 to 85 ?10 t o 60 automotive use life cycle rating max. resistive load 50ma 16 v d c 1m a 5v dc 0.2a 14 v d c 0 .1a 12 v d c 0.1a 30v dc rating min. resistive load 10a 1v d c 50a 3v dc 50a 3v d c durability operating life without load 100,000 cycles 400m max. 30,000 cycles 500m max. 10,000 cycles 15 0 m m a x . 10,000 cycles 50m max. 10,000 cycles 10 0 m m a x . 10,000 cycles 40m max. operating life with load at max. rated load 100,000 cycles 400m max. 30,000 cycles 500m max. 10,000 cycles 15 0 m m a x . 10,000 cycles 50m max. 10,000 cycles 10 0 m m a x . 10,000 cycles 40m max. electrical performance initial contact resistance 200m max. 200m max. 15 0 m m a x . 30m max. 10 0 m m a x . 20m max. insulation resistance 10 0 m m i n . 10 0 v d c 3m min. 10 0 v d c 10 0 m m i n . 500v dc 100m min. 500v dc voltage proof 250v ac f o r 1m i n u t e 10 0 v a c f o r 1m i n u t e 500v ac for 1m i n u t e 5 0 0 v a c f o r 1m i n u t e mechanical performance terminal strength 0.5n for 1minute 5 n f o r 1m i n u t e actuator strength operating direction 50n 49n 30n 50n pulling direction 10 n environmental performance cold ?40 1,000h ?20 96h ?40 500h ?20 96h dry heat 90 1,000h 85 96h 85 500h 85 96h damp heat 60, 9 0 to 95% rh 1,000h 40, 9 0 to 95% rh 9 6h 60, 9 0 to 95% rh 5 00h 40, 9 0 to 95%rh 96h page 12 4 12 5 12 6 12 7 12 9 13 0 push switches soldering conditions ??????????????????????????????????????????????? 138 push switches cautions ????????????????????????????????????????????????????? 139 note indicates applicability to all products in the series. horizontal type detector slide push rotary power dual-in-line package type list of varieties push switches
138 138 horizontal type vertical type soldering time speh series series example of reflow soldering condition 1. heating method: double heating method with infrared heater. 2. temperature measurement: thermocouple 0.1 to 0.2 ca (k) or cc (t) at soldering portion (copper foil surface). a heat resisting tape should be used for fixed measurement. 3. temperature profile 300 200 100 a max. b e d time (s) c pre-heating f max. room temperature temperature (?c ) 1. the condition mentioned above is the temperature on the mounting surface of a pc board. there are cases where the pc board's temperature greatly differs from that of the switch, depending on the pc board's material, size, thickness, etc. the above-stated conditions shall also apply to switch surface temp eratures. 2. soldering conditions differ depending on reflow soldering machines. pri or verification of soldering condition is highly recommended. notes 260 seriesreflow type 230 40 18 0 15 0 12 0 speg spej spef a 3s max. b cs d e fs 10 1s soldering temperature duration of immersion preheating temperature preheating time sppj2, spph1, sped2, sped4, spef spuj, spph2, spph4 spun sppj3 10 0 m a x . 60s max. 2605 5 1s 10 0 m a x . 60s max. 2605 10 1s 2605 5 1s 2605 items dip soldering reference for dip soldering (for pc board terminal types) 3 0 0 10 spuj 3 +1/ 0 s 350 max. speh , spph2 speg, spef spej sped2, sped4 sppj3, sppj2, spun, spph4, spph1 3 5 0 10 3 +1/ 0 s 3 5 0 10 30.5s 3 5 0 10 4s max. 3505 3s max. 3s max. soldering temperature reference for hand soldering for pc board??m push switches soldering conditions detector slide push rotary power dual-in-line package type
|
